Product Overview

CXBD3567 is oneCost-effective single-channel high-speed driver chip, integrated logic processing, level shift and high current drive circuit, designedNew energy and industrial power systemDesign. Its5V-25v ultra-wide power supply rangeCompatible with 12V/24V bus architecture, with-6v ~ 25v logic input voltage tolerance, effectively resist motor back electromotive force interference. Built-in chip9A/8A asymmetric drive capability, can quickly charge and discharge capacitive loads (such as SiC/GaN power devices), significantly reducing switching loss.dWJ嘉泰姆
When the input is suspended or the signal is abnormal, OUTA automatically switches to the high resistance state, and OUTB locks the low level to avoid false triggering of power tube. The SOP8 package combines optimized heat dissipation design and supports continuous high current output. It is suitable for high-density inverter, DCDC module and motor driven board layout.

   ProductCore features dWJ嘉泰姆

    Ultra wide voltage support: The power supply range of VDD is 5V-25V, and the logic input is compatible with-6V to 25V, which is suitable for complex industrial scenarios.dWJ嘉泰姆

Ultra-High driving capability: The output peak current reaches 9A (pull)/8A (fill), which can easily drive high-power MOSFETs and GaN devices.dWJ嘉泰姆

Intelligent Protection mechanism: Built-in VDD undervoltage locking function to prevent abnormal working conditions from damaging the systemdWJ嘉泰姆

Nanosecond response: The input-to-output delay is short, and the rise/failling edge time ≤ 15ns optimizes the high-frequency switching efficiency.dWJ嘉泰姆

Anti-interference design: The input channel is integrated with 400 Kohm pull-down resistor. When suspended, OUTB forces a low level and OUTA high resistance state to ensure system safety.dWJ嘉泰姆

Energy saving advantages: static power consumption <200μa, considering high performance and low standby lossdWJ嘉泰姆

Industrial Packaging: SOP8 compact package, supports wide temperature range from-40 ℃ to 125 ℃dWJ嘉泰姆

   Typical application scenarios dWJ嘉泰姆

    Photovoltaic/energy storage inverter: drives IGBT or SiC modules to improve MPPT efficiencydWJ嘉泰姆

Industrial switching power supply: Compatible with LLC resonant topology and synchronous rectifier circuitdWJ嘉泰姆

Motor control system: support BLDC/PMSM Motor high frequency PWM drivedWJ嘉泰姆

GaN/SiC driving scheme: provides negative pressure shutdown capability to optimize the performance of third-generation semiconductor devicesdWJ嘉泰姆

Car DCDC converter: meet the wide pressure demand of 12V/24V battery systemdWJ嘉泰姆

Smart home appliances: solar controller, variable frequency air conditioner Power Module DrivedWJ嘉泰姆

   Technical Specification (product PDF)dWJ嘉泰姆

For detailed PDF specifications, please scan WeChat and contact us. You can also get free samples and technical support.!dWJ嘉泰姆

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   Product packaging diagramdWJ嘉泰姆

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   Circuit Schematic diagramdWJ嘉泰姆

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 Application DescriptiondWJ嘉泰姆

In switching power supply applications, high current gate drive equipment is required for various reasons. In order to realize fast switching of power equipment anddWJ嘉泰姆
Reduce related switching power loss, powerful Gate Drive chip can control the PWM output of equipment and power semiconductor equipmentdWJ嘉泰姆
Used between gates. When the PWM controller cannot directly drive the power device, the gate driver chip becomes indispensable. With numberdWJ嘉泰姆
The appearance of word power supply will often occur because the PWM signal from the digital controller is usually a 3.3V logic signal,dWJ嘉泰姆
This is not enough to effectively open a power switch. A level shift circuit is required to raise the 3.3V signal to the gate drive voltage.dWJ嘉泰姆
(Such as 12V) to fully open power tube and minimize conduction loss. Traditional buffer driver based on NPN/PNP bipolar transistordWJ嘉泰姆
In the totem pole configuration, due to their lack of level switching capability, it is not enough to use them in digital power supply. Gate drive coredWJ嘉泰姆
The chip effectively combines level shifting and buffer driving functions. In general, the gate driver chip is an extremely important group in switching power supply.dWJ嘉泰姆
It combines the advantages of high performance, low cost, small number of components, reduced board space and simplified system design.dWJ嘉泰姆
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Layout guidedWJ嘉泰姆

In the high-current fast switching circuit, the correct PCB layout is very important, which can provide the stability of the design. CXBD3567 griddWJ嘉泰姆
The driver chip has a short propagation delay and a strong output current, with a smaller rising edge and a failling edge time. At higher VDD powerdWJ嘉泰姆
Under voltage, the peak current capability is even higher (8A peak current is at VDD = 14V). If the routing length anddWJ嘉泰姆
Impedance, very high di/dt will cause unacceptable ringing. When using these high-speed driver chips for design, it is recommendeddWJ嘉泰姆
Use the following Circuit Layout guide.dWJ嘉泰姆
• Keep the driver chip as close to the power device as possible to reduce the length of large current traces between the output pin and the power device gate.dWJ嘉泰姆
• Close the VDD bypass capacitor to the driver chip as much as possible, and the trace length is the shortest to improve the noise filtering effect. These capacitorsdWJ嘉泰姆
The device supports the peak current drawn from VDD when the power device is turned on. We recommend that you use patch capacitor with low inductance.dWJ嘉泰姆
• Enable and close the current loop path (drive chip, power device and VDD bypass capacitor) as much as possible to maintaindWJ嘉泰姆

Minimum parasitic inductance. During the Power Tube on and off transient, high dI/dt will be generated, which will be at the output pin of the driver chip.dWJ嘉泰姆
And cause significant voltage spikes on the gate of the power device.dWJ嘉泰姆

• Where possible, the current input and output traces are parallel, using magnetic flux elimination.dWJ嘉泰姆
• Separate power supply traces and signal traces, such as output and input signals.dWJ嘉泰姆
• Star grounding is a good way to reduce the noise from one current loop coupling to another. The GND of the driver chip should be indWJ嘉泰姆

A single point is connected to other circuit nodes, such as the source of power MOSFETs and the ground of PWM controllers. The connection path should be as good as possible.dWJ嘉泰姆
It can be short to reduce inductance and as wide as possible to reduce resistance.dWJ嘉泰姆

• Use ground layer to provide noise shielding. The fast rise and fall time at OUT may interfere with the input signal. The formation cannot bedWJ嘉泰姆
The conductive path of any current loop. On the contrary, the formation must be connected to the star through a single trace to establish the ground potential.dWJ嘉泰姆
In addition to noise shielding, ground connection can also help heat dissipation.dWJ嘉泰姆

Layout exampledWJ嘉泰姆

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