Product Overview

CXLE86249 is an efficient boost constant current LED driver that integrates high-frequency power transistors and Schottky diodes, supporting;2.5V~25V wide input voltage, can accurately drive 1-8 strings of LEDThe chip adopts 1.2MHz constant switching frequency  With built-in frequency compensation circuit, it significantly reduces the size and cost of peripheral components, optimizing PCB space utilization. Its;Design of 200mV low feedback voltage  Significantly reduce the power consumption of external sampling resistors, combined with EN pins;TTL power on/off control  With 0%~100% PWM stepless dimming  Designed specifically for ultra-low static current (shutdown current of only 3μ A) and miniaturized devices, it is an ideal power solution for portable electronic products.

   Core advantages and characteristics qO6嘉泰姆

   Efficient and Flexible DesignqO6嘉泰姆

Wide compression compatibility2.5V~25V input range, compatible with lithium batteries, USB power supply, and multi scene power systemsqO6嘉泰姆

High power outputMaximum 1A switch current, with an efficiency of over 88%, meeting the needs of high current LED drivingqO6嘉泰姆

High frequency integration solutionBuilt in high-frequency power transistor and Schottky diode, supporting boost/SEPIC topology, flexible adaptation to complex circuitsqO6嘉泰姆

Intelligent Control and Energy Conservation

Accurate dimmingContinuous PWM brightness adjustment (duty cycle 0~100%) through EN pin, suitable for dynamic backlight scenesqO6嘉泰姆

ultra-low power3μ A ultra-low shutdown current, extending the battery life of wearable devices and handheld terminalsqO6嘉泰姆

Multiple protection and reliability

System level protectionLED open circuit protection, thermal shutdown protectionqO6嘉泰姆

Anti interference enhancementClass 3A HBM ESD protection (>8kV) ensures stable operation in harsh environmentsqO6嘉泰姆

Ultra miniature packaging

Extremely compactDFN3 * 3-8 package (3mm× 3mm), with a thickness of only 0.8mm, suitable for micro devices with extremely limited spaceqO6嘉泰姆

Heat dissipation optimizationExposed solder pads at the bottom of the package enhance heat dissipation and support continuous high current outputqO6嘉泰姆

   Typical application scenarios qO6嘉泰姆

wearable devicesSmart watches, TWS earphones, AR/VR glasses with LED lightingqO6嘉泰姆

Imaging and Industrial EquipmentDigital camera flash, PDA scanning module, industrial auxiliary displayqO6嘉泰姆

Portable ElectronicsHandheld scanning terminal, mini projector, e-book readerqO6嘉泰姆

   Technical Specifications (Product PDF);qO6嘉泰姆

      For detailed PDF specifications, please scan WeChat to contact us. You can also receive free samples and technical support！qO6嘉泰姆

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   Product packaging diagram;qO6嘉泰姆

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   Circuit schematic diagram;qO6嘉泰姆

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Bill of MaterialsqO6嘉泰姆

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DEMO physical imageqO6嘉泰姆

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PCB layoutqO6嘉泰姆

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     PCB wiring rulesqO6嘉泰姆

       1. Shorten the discontinuous current circuit: the positive pole of the output capacitor is close to the OUTN of the chip, and the negative pole of the output capacitor is close to the OUTN of the chipqO6嘉泰姆
            The GND of the chip is used to further reduce its parasitic inductance, minimize glitch voltage, and improve system stability;qO6嘉泰姆
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      2. The ceramic capacitor at the input end is used to filter out high-frequency voltage spikes and provide pure power to the internal logic circuit of the chip,qO6嘉泰姆
        Ceramic capacitors are located near the VIN and GND pins of the chip;qO6嘉泰姆

 3. Power lines such as VIN, SW, OUTP, OUTN, GND, etc. should be treated with copper plating as much as possible to achieve thickness, length, and straightness;qO6嘉泰姆
  4. CS feedback wiring should be kept away from inductor, SW and other switch signal nodes, and the best way is to surround it with GND wiring.qO6嘉泰姆
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Application InformationqO6嘉泰姆

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      Typical characteristicsqO6嘉泰姆

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