Product Overview

CXSU63301 is a highly integrated boost DC-DC converter that combines high-frequency power transistors and Schottky diodes, supporting19A嘉泰姆
2.5V to 25V wide input voltageFlexible configuration through external voltage divider resistors3V to 32V output voltageProvide for compact electronic devices19A嘉泰姆
Provide high-performance power solutions.19A嘉泰姆

The chip adopts1.2MHz constant switching frequencyCompared with the built-in frequency compensation technology, a complete circuit can be constructed with only 5 peripheral components19A嘉泰姆
The overall plan reduces BOM costs by 40% while compressing PCB layout area to 50mm² Within. its410mV ultra-low feedback voltagedesign19A嘉泰姆
Reduce sampling resistance loss by 60%, combined with3μ A ultra-low standby currentBecoming an ideal choice for wearable devices and IoT terminals.19A嘉泰姆

   Product Features;19A嘉泰姆

   Core performance highlights:19A嘉泰姆

• 600mA continuous output capability，87% peak conversion efficiencySupports boost/SEIC dual topology structure19A嘉泰姆

• Multiple protection mechanismsOVP overvoltage protection, TSD thermal shutdown protection, Class 3A ESD protection19A嘉泰姆

• Intelligent control interfaceEN pin is compatible with TTL level and supports millisecond level on/off response19A嘉泰姆

• Miniature packagingDFN3 * 3-8 (3× 3× 0.8mm) ultra-thin design, suitable for space sensitive devices19A嘉泰姆

  Technological breakthrough points:

1. Fully integrated designBuilt in MOSFET+Schottky diode, peripheral components only require inductance+capacitance+resistance19A嘉泰姆

2. Dynamic response optimization：± 2% output voltage accuracy, transient response time<20&ms19A嘉泰姆

3. Multi-mode topologyFree switching boost/SEPIC architecture, adapted to complex voltage conversion requirements19A嘉泰姆

4. Ultra thin heat dissipation solutionDFN package bottom exposed copper design, thermal resistance as low as 40 ℃/W19A嘉泰姆

5. Industrial grade reliabilitySupports working temperatures from -40 ℃ to+105 ℃ and has passed 2000 hours of high-temperature aging testing19A嘉泰姆

This solution complies with the IEC62368 safety standard and RoHS environmental certification, and is particularly suitable for smart hardware designs that require strict space utilization and energy efficiency,19A嘉泰姆
Can help customers shorten their R&D cycle by 30% and reduce overall costs by 15%.19A嘉泰姆

Product differentiation advantageCompared to similar competitors, CXSU63301 achieves a wider output voltage range (3-32V) in the same package size,19A嘉泰姆
And it supports SEPIC topology structure, which can flexibly cope with input voltage fluctuation scenarios and significantly improve system stability.19A嘉泰姆

   Application scope;19A嘉泰姆

• Smart Watch/AR Glasses Power Supply System
• Industrial grade sensor network node
• Car navigation and OBD diagnostic module
• Photovoltaic micro inverter auxiliary power supply
• 5G Communication Module (CPE/DTU)

   Technical Specifications (Product PDF)Return to TOP 19A嘉泰姆

      For detailed PDF specifications, please scan WeChat to contact us. You can also receive free samples and technical support！19A嘉泰姆

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   Product packaging diagram;19A嘉泰姆

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   Circuit schematic diagram;19A嘉泰姆

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   Bill of Materials19A嘉泰姆

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      PCB layout19A嘉泰姆

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      DEMO physical image19A嘉泰姆

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      Typical performance curve19A嘉泰姆

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      Application Information19A嘉泰姆

   PCB Layout Guide19A嘉泰姆
1. Power lines such as VIN, GND, SW, OUTP, OUTN, etc., thick, short, and straight;19A嘉泰姆
2. FB wiring should be kept away from switch signals such as inductors, and it is recommended to use a ground wire to surround it;19A嘉泰姆
3. The output capacitor is located near the OUTN and GND pins of the chip;19A嘉泰姆
4. The input capacitor is located near the VIN and GND pins of the chip.19A嘉泰姆

   Selection Guide for Related Chips;                    More similar products .....19A嘉泰姆