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目录rDa嘉泰姆

1.产品概述                       2.产品特点rDa嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 rDa嘉泰姆
5.产品封装图                     6.电路原理图                   rDa嘉泰姆
7.功能概述                        8.相关产品rDa嘉泰姆

一,产品概述(General Description)     rDa嘉泰姆

           The CXSD62100 is a voltage mode, fixed 300kHz witching frequency, synchronous buck converter. The CXSD62100 allows wide input voltage that is either a single 5~12V or two supply voltage(s) for various applications. A power-on-reset (POR) circuit monitors the VCC supply voltage to prevent wrong logic controls. A built-in soft-start circuit prevents the output voltages from overshoot as well as limits the input current. An internal 0.6V temperature-com-pensated reference voltage with high accuracy is de-signed to meet the requirement of low output voltage applications. The CXSD62100 provides excellent output volt-age regulations against load current variation. CXSD62100 is built in remote sense function for applications that re-quire remote sense. (TDFN-10 3mmx3mm Package Only)The controller’s over-current protection monitors the out-put current by using the voltage drop across the RDS (ON) of low-side MOSFET, eliminating the need for a cur-rent sensing resistor that features high efficiency and low cost. In addition, the CXSD62100 also integrates excel-lent protection functions. The over-voltage protection (OVP) , under-voltage protection (UVP). OVP circuit which moni-tors the FB voltage to prevent the PWM output from over voltage, and UVP circuit which monitors the FB voltage to prevent the PWM output from under voltage or short circuit.rDa嘉泰姆
       The CXSD62100 is available in TDFN3x3-10 packagesrDa嘉泰姆
二.产品特点(Features)rDa嘉泰姆

1.）Wide 5V to 12V Supply VoltagerDa嘉泰姆
2.）Power-On-Reset Monitoring on VCCrDa嘉泰姆
3.）Excellent Output Voltage RegulationsrDa嘉泰姆
      - 0.6V Internal ReferencerDa嘉泰姆
      - ±0.6% Over-Temperature RangerDa嘉泰姆
4.）Integrated Soft-StartrDa嘉泰姆
5.）Voltage Mode PWM Operation with External CompensationrDa嘉泰姆
6.）Up to 90% Duty Ratio for Fast Transient ResponserDa嘉泰姆
7.）Constant Switching Frequency - 300kHz ±10%rDa嘉泰姆
8.）Integrated Bootstrap Forward P-CH MOSFETrDa嘉泰姆
9.）50% Under-Voltage ProtectionrDa嘉泰姆
10.）125% Over-Voltage ProtectionrDa嘉泰姆
11.）Adjustable Over-Current Protection ThresholdrDa嘉泰姆
      - Using the RDS(ON) of Low-Side MOSFETrDa嘉泰姆
12.）Shutdown Control by COMPrDa嘉泰姆
13.）Power Good Monitoring (TDFN-10 3mmx3mm Package Only)rDa嘉泰姆
14.）Remote Feedback Sense for Excellent OutputrDa嘉泰姆
15.）Voltage (TDFN-10 3mmx3mm Package Only) TDFN3x3-10 PackagerDa嘉泰姆
16.）Lead Free and Green Devices AvailablerDa嘉泰姆
三,应用范围 (Applications)rDa嘉泰姆

Graphic CardsrDa嘉泰姆
DSL, Switch HUBrDa嘉泰姆
Wireless LanrDa嘉泰姆
Notebook ComputerrDa嘉泰姆
Mother BoardrDa嘉泰姆
LCD Monitor/TVrDa嘉泰姆
四.下载产品资料PDF文档 rDa嘉泰姆

需要详细的PDF规格书请扫一扫微信联系我们，还可以获得免费样品以及技术支持！rDa嘉泰姆

 rDa嘉泰姆

五,产品封装图 (Package)rDa嘉泰姆

rDa嘉泰姆

六.电路原理图rDa嘉泰姆

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七,功能概述rDa嘉泰姆

Layout ConsiderationrDa嘉泰姆
In any high switching frequency converter, a correct lay-out is important to ensure proper operation of therDa嘉泰姆
regulator. With power devices switching at 300kHz,the resulting current transient will cause voltage spike acrossrDa嘉泰姆
the interconnecting impedance and parasitic circuit elements. As an example, consider the turn-off transitionrDa嘉泰姆
of the PWM MOSFET. Before turn-off, the MOSFET is car-rying the full load current. During turn-off, current stopsrDa嘉泰姆
flowing in the MOSFET and is free-wheeling by the lower MOSFET and parasitic diode. Any parasitic inductance ofrDa嘉泰姆
the circuit generates a large voltage spike during the switching interval. In general, using short and wide printedrDa嘉泰姆
circuit traces should minimize interconnecting imped ances and the magnitude of voltage spike. And signalrDa嘉泰姆
and power grounds are to be kept separate till combined using ground plane construction or single pointrDa嘉泰姆
grounding. Figure 8. illustrates the layout, with bold lines indicating high current paths; these traces must be shortrDa嘉泰姆
and wide. Components along the bold lines should be placed lose together. Below is a checklist for your layout:rDa嘉泰姆
- Keep the switching nodes (UGATE, LGATE, and PHASE)away from sensitive small signal nodes since theserDa嘉泰姆
nodes are fast moving signals. Therefore, keep traces to these nodes as short as possible.rDa嘉泰姆
- The traces from the gate drivers to the MOSFETs (UG and LG) should be short and wide.rDa嘉泰姆
- Place the source of the high-side MOSFET and the drain of the low-side MOSFET as close as possible. Minimiz-rDa嘉泰姆
ing the impedance with wide layout plane between the two pads reduces the voltage bounce of the node.rDa嘉泰姆
- Decoupling capacitor, compensation component, the resistor dividers, and boot capacitors should be closerDa嘉泰姆
their pins. (For example, place the decoupling ceramiccapacitor near the drain of the high-side MOSFET asrDa嘉泰姆
close as possible. The bulk capacitors are also placed near the drain).rDa嘉泰姆
- The input capacitor should be near the drain of the up-per MOSFET; the output capacitor should be near therDa嘉泰姆
loads. The input capacitor GND should be close to the output capacitor GND and the lower MOSFET GND.rDa嘉泰姆
 The drain of the MOSFETs (VIN and PHASE nodes) should be a large plane for heat sinking.rDa嘉泰姆
- The ROCSET resistance should be placed near the IC as close as possible.rDa嘉泰姆

八,相关产品                   更多同类产品...... rDa嘉泰姆

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