Product Overview

CXSU63299 is an integrated and efficient step-up DC-DC power management chip, which adopts innovative design to integrate high-frequency power transistor and MHz diode into a single package. The device supports a wide range of input voltage from 2.5V to 20V, and can flexibly configure output voltage from 3V to 32V through external divider resistance, which is especially suitable for smart device applications requiring voltage conversion.Bxr嘉泰姆

With 1.2MHz constant switching frequency and built-in frequency compensation technology, the peripheral circuit design is significantly simplified CXSU63299, and a complete power system can be built only with small standard components. This design not only reduces the overall solution cost by 30%, but also reduces the PCB layout area by more than 40%. Its 410mV ultra-low feedback voltage technology effectively reduces the power consumption of sampling resistor, and combines the standby current characteristic of only 3μA to become an ideal choice for battery-powered equipment.Bxr嘉泰姆

In terms of core performance, the chip has 500mA continuous output capability, with a maximum conversion efficiency of 87%. The innovative dual protection mechanism (OVP overvoltage protection + TSD thermal shutdown) cooperates with Class 3A ESD protection level to ensure stable operation of the system. The EN pin supports TTL Levcon level control to implement intelligent power management. SOT23-6 ultra-thin package (2.9 × 2.8 × 1.3mm) is especially suitable for modern electronic devices with limited space.Bxr嘉泰姆

   Product FeaturesBxr嘉泰姆

• Fully Integrated Design: Built-in MOSFET MHz diode
• Adaptive compensation: eliminates external compensation component requirements
• Intelligent Energy saving: dual-mode automatic switching of working/standby mode
• Enhanced protection: OVP TSD ESD triple protection system
• Precision control: ± 2% output voltage accuracy
• Environmental Adaptation:-40 ℃ to 85 ℃ wide temperature working range

   Application ScopeBxr嘉泰姆

   Technical Specification (product PDF)Bxr嘉泰姆

For detailed PDF specifications, please scan WeChat and contact us. You can also get free samples and technical support.!Bxr嘉泰姆

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   Product packaging diagramReturn to TOPBxr嘉泰姆

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   Circuit Schematic diagramBxr嘉泰姆

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Bill of MaterialsBxr嘉泰姆
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PCB layoutBxr嘉泰姆
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DEMO physical pictureBxr嘉泰姆
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Typical performance curveBxr嘉泰姆
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Application InformationBxr嘉泰姆
PCB layout guideBxr嘉泰姆
1. VIN, GND, SW, VOUT and other power lines, thick, short, straight;Bxr嘉泰姆
2. FB routing is far away from switching signals such as Inductance. It is recommended to use ground wire to surround it;Bxr嘉泰姆
3. The output capacitor is close to the VOUT and GND pins of the chip;Bxr嘉泰姆
4. The input capacitor is close to the chip VIN and GND pins.Bxr嘉泰姆

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