CXLE83182EN is a high-performance LED constant current driver chip designed specifically for general-purpose power supplies. It operates in critical conduction mode (CrM), effectively reducing switching losses and electromagnetic interference (EMI) while improving system efficiency. This chip greatly simplifies the peripheral circuit, reduces the number of components, and improves the overall reliability of the system by removing traditional VCC and COMP capacitors.
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[ CXLE83182EN ]"
In the design of LED lighting systems, the stability, energy efficiency, and reliability of driving chips are key factors determining product competitiveness.CXLE83182EN As a high-precision non isolated buck LED driver chip with DIP7 packaging and integrated active power factor correction (APFC), it has become an ideal solution for various general LED lighting applications due to its excellent electrical performance, good heat dissipation structure, and comprehensive system protection. This article will delve into the technical characteristics, design methods, and advantages of CXLE83182EN in practical applications.
1、 Overview and Technical Highlights of Chips
CXLE83182EN is a high-performance LED constant current driver chip designed specifically for general-purpose power supplies. It operates in critical conduction mode (CrM), effectively reducing switching losses and electromagnetic interference (EMI) while improving system efficiency. This chip greatly simplifies the peripheral circuit, reduces the number of components, and improves the overall reliability of the system by removing traditional VCC and COMP capacitors.
Its core advantages include:
· High power factor and low harmonic distortionBuilt in active PFC circuit, with high PF value and low THD, in compliance with international energy efficiency standards;
· Design of VCC/COMP capacitor without VCSimple circuit, lower cost, and higher reliability;
· External current sampling resistorSupport flexible output current settings;
· Critical conduction mode operationOptimize EMI performance and improve overall efficiency;
· Multiple protection mechanismsIntegrated LED short-circuit protection, open circuit protection (OVP adjustable), cycle by cycle current limiting, and overheating regulation;
· Enable feature supportCompatible with intelligent lighting applications such as switch color adjustment and sensing control;
· DIP7 packageDurable packaging, good heat dissipation performance, easy to manually weld and repair, suitable for various installation environments.
2、 Electrical performance and key parameters
CXLE83182EN has good robustness and adaptability in electrical design. It integrates high-voltage power MOSFET internally, with a breakdown voltage of 600V and a minimum on resistance of only 2.2 Ω; (FN version), supports wide voltage input. The working junction temperature range of the chip is -40 ℃ to 150 ℃, and it has intelligent overheating adjustment function. When the surface temperature of the chip reaches 140 ℃, it automatically reduces the output current to prevent overheating damage and improve the system life.
The main electrical parameters are as follows:
· The typical value of static working current is 0.4mA, with a maximum of 0.6mA;
· Maximum conduction time 6.6&ms, maximum turn off time 200&ms;
· The peak voltage limit of CS pin is 1.8V, with built-in 300ns front edge blanking and 200ns turn off delay;
· The typical value of the internal reference voltage is 300mV, with an accuracy of up to± 3%；
· The OVP pin outputs a current of approximately 100 A and supports setting open circuit protection voltage through an external resistor.
3、 Typical Applications and Design Guidelines
CXLE83182EN is widely used in LED bulb lights, LED tubes, and other general lighting products. Its typical application circuit is simple and clear, with flexible design, and users can meet different output requirements by adjusting a few peripheral components.
The calculation formula for LED output current is:
Among them, VREF For internal reference voltage (typical 300mV), RCS; A current sampling resistor. By selecting RCS reasonably, the required output current can be accurately set.
Formula for setting open circuit protection voltage:
Among them, L is the inductance value (in mH), ROVP Ground resistance of OVP pin (unit: kΩ); ）. It should be noted that the ROVP pin also has an Enable function: when the voltage is above 0.3V, the chip is turned on, and when it is below 0.1V, the chip is turned off. Therefore, the ROVP resistance should be greater than 3k Ω;. If OVP function is not required, the pin can be left hanging.
4、 System protection and reliability design
The CXLE83182EN integrates comprehensive protection functions to ensure stable operation of the system in various abnormal situations:
· short circuit protectionWhen there is an output short circuit, the chip automatically enters a low-frequency working mode (5kHz), limiting the output current;
· open-circuit protectionSet the OVP threshold through an external resistor to prevent damage to the system caused by excessive output voltage;
· Cycle by cycle current limitationReal time monitoring of CS voltage to prevent inductance saturation and MOSFET overcurrent;
· Overheating regulationGradually reduce the output current when the chip temperature rises to achieve temperature closed-loop control;
· Intelligent Enable ControlEnable and disable the chip through the voltage of the ROVP pin, facilitating system control.
5、 Suggestions for PCB layout and heat dissipation optimization
Reasonable PCB design is crucial for system performance, EMI, and reliability:
5.1. Ground wire layoutThe power ground wire of the current sampling resistor should be short and thick, and should be as close as possible to the GND pin of the chip to reduce noise interference;
5.2. Power Loop OptimizationThe main power circuit (such as DRAIN inductor freewheeling diode) should maintain a minimum area to reduce radiated EMI;
5.3. DRAIN pin heat dissipationDIP7 package has good heat dissipation performance, and the area of pin pads and connected copper foils can be appropriately increased to further enhance the heat dissipation effect;
5.4. CS pin processingIt should be kept away from high-frequency noise sources and arranged compactly to ensure the accuracy of current sampling.
6、 Packaging and ordering information
CXLE83182EN adopts DIP7 packaging, with a sturdy structure and standard pin spacing, making it easy to solder and test. The encapsulation thermal resistance (JA) is 80 degrees Celsius; C/W， The heat dissipation performance is superior to most surface mount packages. The ordered model is CXLE83182EN, with a working environment temperature range of -40 ℃ to 105 ℃. The packaging is in tube form, with 50 pieces per tube, clearly labeled for production management and material traceability.
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eighty percentConclusion
The CXLE83182EN provides an efficient, reliable, and easy to implement driver solution for LED lighting systems with its high-precision constant current output, high power factor, robust DIP packaging, and comprehensive protection features. Whether it is commercial lighting that emphasizes long-term reliability or civilian bulb lights that require high cost-effectiveness, this chip can provide excellent performance support.
For complete data manuals, application circuit references, sample applications, or procurement inquiries, please visit;jtm-ic.comWe will provide you with professional and comprehensive technical support and product services.
