Product Overview

Return to TOP

CXSU63302 is a high-performance boost DC-DC converter that integrates high-frequency power transistors and Schottky diodes,FIf嘉泰姆
support2.5V to 25V wide input voltageFlexible setting through external voltage divider resistor3V to 27V output voltageSpecially designed for highFIf嘉泰姆
Density power supply scenario design, especially suitable for intelligent devices and industrial control systems that require high current output.FIf嘉泰姆

The chip adopts1.2MHz constant switching frequencyWith adaptive frequency compensation technology, only 4 peripheral components are needed to construct a complete systemFIf嘉泰姆
Circuit, reducing material costs by 45% compared to traditional solutions, while achieving PCB layout area of 60mm; The ultimate compact design.FIf嘉泰姆
its410mV ultra-low feedback voltageTechnology reduces sampling resistance loss by 65%, combined with3μ A ultra-low standby power consumptionSignificantly prolongedFIf嘉泰姆
The endurance of battery powered equipment.FIf嘉泰姆

   Product Features;FIf嘉泰姆

    Core performance advantages:FIf嘉泰姆

• 1A continuous output current，89% peak conversion efficiencySupports free switching between boost/SEIC dual topologiesFIf嘉泰姆

• Triple security protectionOVP overvoltage protection (5% threshold), TSD thermal shutdown (triggered at 150 ℃), Class 3A ESD protectionFIf嘉泰姆

• Intelligent power managementThe EN pin supports TTL level control, with a power on/off response time of less than 50 secondsFIf嘉泰姆

• Industrial grade packagingDFN3 * 3-8 (3× 3× 0.8mm) ultra-thin package, bottom exposed copper design achieves thermal resistance of only 35 ℃/WFIf嘉泰姆

         Technological breakthrough points:FIf嘉泰姆

1. Fully integrated architectureBuilt in MOSFET+Schottky diode, reducing the number of peripheral components by 70%FIf嘉泰姆

2. Precision voltage control：± 1.8% output voltage accuracy, load adjustment rate<0.5%FIf嘉泰姆

3. Dynamic mode switchingAutomatically switch PWM/PFM mode, increase light load efficiency to 82%FIf嘉泰姆

4. Enhanced heat dissipation designSupport continuous 1A output without derating (Ta=85 ℃)FIf嘉泰姆

5. Adaptation to industrial environmentWorking temperature range of -40 ℃ to+125 ℃, certified with MSL-1 humidity sensitivity levelFIf嘉泰姆

This solution complies with the IEC61000-4-2 electrostatic protection standard and RoHS environmental requirements, and is particularly suitable for power density, efficiency, and reliabilityFIf嘉泰姆
In demanding fields, we can help customers shorten development cycles by 40% and reduce system power consumption by 20%FIf嘉泰姆
Differentiated competitivenessCompared to competitors of the same specifications, CXSU63302 maintains 89% ultra-high efficiency at 1A output and supports SEPIC topologyFIf嘉泰姆
The structure can cope with complex scenarios where the input voltage is lower/higher than the output voltage, significantly improving the flexibility of system design.FIf嘉泰姆

   Application scope;FIf嘉泰姆

• New Energy Vehicle Electronics (OBD/Car Charger)
• 5G base station micro power module
• Smart Home Control System
• Medical electronic devices (portable monitoring devices)
• Photovoltaic energy storage system auxiliary power supply

   Technical Specifications (Product PDF);FIf嘉泰姆

      For detailed PDF specifications, please scan WeChat to contact us. You can also receive free samples and technical support！FIf嘉泰姆

       FIf嘉泰姆

   Product packaging diagram;Return to TOPFIf嘉泰姆

   FIf嘉泰姆

   Circuit schematic diagram;FIf嘉泰姆

FIf嘉泰姆

      Bill of MaterialsFIf嘉泰姆
               FIf嘉泰姆
      DEMO physical imageFIf嘉泰姆
               FIf嘉泰姆
      PCB layoutFIf嘉泰姆
             FIf嘉泰姆
      PCB wiring rulesFIf嘉泰姆
            1. Shorten the discontinuous current circuit: the positive terminal of the output capacitor is close to the OUTN of the chip, and the negative terminal of the output capacitorFIf嘉泰姆
              Approaching the GND of the chip to further reduce its parasitic inductance, minimize glitch voltage, and improve system stability;FIf嘉泰姆
           FIf嘉泰姆
              2. The ceramic capacitor at the input end is used to filter out high-frequency voltage spikes and provide pure power to the internal logic circuit of the chip,FIf嘉泰姆
                Ceramic capacitors are located near the VIN and GND pins of the chip;FIf嘉泰姆

3. Power lines such as VIN, SW, OUTP, OUTN, GND, etc. should be treated with copper plating as much as possible to achieve thickness, length, and straightness;FIf嘉泰姆
4. FB feedback wiring should be kept away from inductor, SW and other switch signal nodes, and preferably surrounded by GND wiring.FIf嘉泰姆

      Application InformationFIf嘉泰姆
       FIf嘉泰姆
      Typical characteristicsFIf嘉泰姆
             FIf嘉泰姆
             FIf嘉泰姆
             FIf嘉泰姆
   Selection Guide for Related Chips;                    More similar products .....FIf嘉泰姆