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CXSD62554 Three-Channel PWM Converter-High Efficiency Power Management Chip | Jiatem Semiconductor

The CXSD62554 is a three-channel synchronous PWM converter where the first channel supports a maximum of 2.5A output current and the second and third channels each support 1.5A output. The chip adopts current control mode, with a built-in reference voltage of 0.6V ± 1% accuracy, and the output voltage can be flexibly set through an external resistor divider network, ranging from 0.6V to 3.6V. The input voltage range is 4.5V to 5.5V, and the typical quiescent current is only 200 μA, which effectively improves the light load efficiency.

CXSD62554 Three-Channel PWM Converter-High Efficiency Power Management Chip | Jiatem Semiconductor
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Product introduction

CXSD62554 Three-Channel PWM Converter: Ideal for Efficient Power Management

In today's high-performance electronic systems, the performance of power management chips directly affects the stability, efficiency and reliability of the entire system. Jiatem Semiconductor launchedCXSD62554It is a high-efficiency, multi-channel synchronous buck converter designed for modern digital systems. It not only has excellent electrical performance, but also integrates rich protection functions. It is suitable for DDR4, LPDDR4, LPDDR4X and other memory power supply scenarios. It is an ideal power supply solution for set-top boxes, network equipment, optical communication and other applications.NdA嘉泰姆

Product overview

CXSD62554is a three-channel synchronous PWM converter in which the first channel supports a maximum output current of 2.5A, and the second and third channels each support 1.5A output. The chip adopts current control mode, with a built-in reference voltage of 0.6V ± 1% accuracy, and the output voltage can be flexibly set through an external resistor divider network, ranging from 0.6V to 3.6V. The input voltage range is 4.5V to 5.5V, and the typical quiescent current is only 200 μA, which effectively improves the light load efficiency.NdA嘉泰姆

In order to reduce the system noise, the three channels adopt 120 ° phase difference operation mode, which significantly reduces the input current ripple and reduces the requirements for external capacitors and EMI filters. Internal integration of a variety of protection mechanisms, including over-voltage protection (OVP), under-voltage protection (UVP), over-current protection (OCP) and over-temperature protection (OTP), to ensure the safe operation of the system in a variety of abnormal conditions.NdA嘉泰姆

Core Features and Benefits

High efficiency and low power consumption

CXSD62554 maintain high efficiency under light load conditions, its typical quiescent current is only 200 μA, and the shutdown current is as low as 30 μA. The internal integrated optimized N-channel MOSFET has an on-resistance of 120mΩ on the upper tube and 30mΩ(CH1) and 50mΩ(CH2/CH3) on the lower tube, which minimizes the conduction loss.NdA嘉泰姆

Supports LPDDR4/X power timing

The chip is specially designed for LPDDR4/X power timing of JEDEC standard. It has built-in Power Flag(PF) signal output, which can be triggered when CH1 output voltage reaches 50%, and is used to control the power-on sequence of subsequent power rails. At the same time, the PG_RESET pin is pulled high after the output voltage of all channels reaches 90% and the delay is 150ms, providing a system-level power good signal.NdA嘉泰姆

Integrated reset and protection functions

CXSD62554 built-in independent external reset (EXT_RESET) input, with PG_RESET output, can replace the external reset chip, simplify system design. When under-voltage, over-current or over-temperature faults are detected, the chip automatically enters the hiccup mode and restarts periodically to reduce thermal stress and improve system reliability.NdA嘉泰姆

Miniaturized Package and Thermal Management

The chip is packaged in a VTQFN3x3-20 package, with a compact size and excellent thermal performance. It is recommended to define all layers under the VIN pad as VIN planes and connect them through vias during design to enhance heat dissipation. The junction temperature can reach up to 150°C, with an overheat return of 30°C, ensuring stable operation in harsh environments.NdA嘉泰姆

Typical application scenarios

  • STB and Digital TVNdA嘉泰姆

  • DDR4/LPDDR4/LPDDR4X Memory PoweredNdA嘉泰姆

  • passive optical network equipmentNdA嘉泰姆

  • G.fast and xDSL network equipmentNdA嘉泰姆

  • Embedded System and Industrial ControlNdA嘉泰姆

Design Suggestions and Layout Points

To ensure system performance, the following guidelines are recommended for layout:NdA嘉泰姆

  1. Input capacitanceIt should be as close as possible to the VIN and PGND pins, and the distance is recommended to be less than 2mm. Avoid using vias.NdA嘉泰姆

  2. VCC capacitanceIt is recommended to use 10μF ceramic capacitor close to VCC pin and GND.NdA嘉泰姆

  3. InductanceClose to the LX pin to reduce noise coupling.NdA嘉泰姆

  4. feedback networkIt should be close to the FB pin and away from the high frequency switch node.NdA嘉泰姆

  5. ground planeA star connection or full ground plane shall be used with a large area GND area under the thermal pad.NdA嘉泰姆

Packaging and Reliability

The CXSD62554 is VTQFN3x3-20 packaged and RoHS compliant, supporting lead-free and green processes. The product has passed a number of reliability tests, including high temperature working life, temperature cycle, damp heat, electrostatic protection, etc., to ensure long-term stable operation in harsh environments.NdA嘉泰姆

Conclusion

With its high efficiency, multi-channel output, perfect protection mechanism and compact package, the CXSD62554 of Gateam Semiconductor has become the preferred solution for power management in modern electronic systems. Whether it is used in consumer electronics, network equipment or industrial control, it can provide stable, efficient and reliable power support. For more technical details or application samples, please visit the official website of Jiatem:jtm-ic.com.NdA嘉泰姆